SOCKET IC, +0.1UF, 20WAY; No. of Contacts: 20Contacts; Connector Type: DIP; Pitch Spacing: 2.54mm; Product Range: -; Row Pitch: 7.62mm; Contact Material: Beryllium Copper; Contact Plating: Gold Plated Contacts; SVHC: No SVHC (15-Jan-2018); Connector Mounting Orientation: PC Board; Contact Resistance: 3.5mohm; Contact Termination: Through Hole Vertical; Contact Termination Type: Through Hole; External Length / Height: 4.45mm; Flammability Rating: UL94V-0; Insulation Resistance: 5000Mohm; Lead Spacing: 2.54mm; Material: Glass epoxy laminate body; Operating Temperature Max: 125°C; Operating Temperature Min: -65°C; Pin Format: DIP

SOCKET IC, +0.1UF, 24WAY; No. of Contacts: 24Contacts; Connector Type: DIP; Pitch Spacing: 2.54mm; Product Range: -; Row Pitch: 7.62mm; Contact Material: Beryllium Copper; Contact Plating: Gold Plated Contacts; SVHC: No SVHC (15-Jan-2018); Connector Mounting Orientation: PC Board; Contact Resistance: 3.5mohm; Contact Termination: Through Hole Vertical; Contact Termination Type: Through Hole; External Length / Height: 4.45mm; Flammability Rating: UL94V-0; Insulation Resistance: 5000Mohm; Lead Spacing: 2.54mm; Material: Glass epoxy laminate body; Operating Temperature Max: 125°C; Operating Temperature Min: -65°C; Pin Format: DIP

SOCKET IC, +0.1UF, 28WAY; No. of Contacts: 28Contacts; Connector Type: DIP; Pitch Spacing: 2.54mm; Product Range: -; Row Pitch: 15.24mm; Contact Material: Beryllium Copper; Contact Plating: Gold Plated Contacts; SVHC: No SVHC (15-Jan-2018); Connector Mounting Orientation: PC Board; Contact Resistance: 3.5mohm; Contact Termination: Through Hole Vertical; Contact Termination Type: Through Hole; External Length / Height: 4.45mm; Flammability Rating: UL94V-0; Insulation Resistance: 5000Mohm; Lead Spacing: 2.54mm; Material: Glass epoxy laminate body; Operating Temperature Max: 125°C; Operating Temperature Min: -65°C; Pin Format: DIP

SOCKET IC, +0.1UF, 14WAY; No. of Contacts: 14Contacts; Connector Type: DIP; Pitch Spacing: 2.54mm; Product Range: -; Row Pitch: 7.62mm; Contact Material: Beryllium Copper; Contact Plating: Gold Plated Contacts; SVHC: No SVHC (15-Jan-2018); Connector Mounting Orientation: PC Board; Contact Resistance: 3.5mohm; Contact Termination: Through Hole Vertical; Contact Termination Type: Through Hole; External Length / Height: 4.45mm; Flammability Rating: UL94V-0; Height: 4.45mm; Insulation Resistance: 5000Mohm; Lead Spacing: 2.54mm; Material: Glass epoxy laminate body; Operating Temperature Max: 125°C; Operating Temperature Min: -65°C; Pin Format: DIP

SOCKET IC, +0.1UF, 40WAY; No. of Contacts: 40Contacts; Connector Type: DIP; Pitch Spacing: 2.54mm; Product Range: -; Row Pitch: 15.24mm; Contact Material: Beryllium Copper; Contact Plating: Gold Plated Contacts; SVHC: No SVHC (15-Jan-2018); Connector Mounting Orientation: PC Board; Contact Resistance: 3.5mohm; Contact Termination: Through Hole Vertical; Contact Termination Type: Through Hole; External Length / Height: 4.45mm; Flammability Rating: UL94V-0; Insulation Resistance: 5000Mohm; Lead Spacing: 2.54mm; Material: Glass epoxy laminate body; Operating Temperature Max: 125°C; Operating Temperature Min: -65°C; Pin Format: DIP

SOCKET IC, +0.1UF, 16WAY; No. of Contacts: 16Contacts; Connector Type: DIP; Pitch Spacing: 2.54mm; Product Range: -; Row Pitch: 7.62mm; Contact Material: Beryllium Copper; Contact Plating: Gold Plated Contacts; SVHC: No SVHC (15-Jan-2018); Connector Mounting Orientation: PC Board; Contact Resistance: 3.5mohm; Contact Termination: Through Hole Vertical; Contact Termination Type: Through Hole; External Length / Height: 4.45mm; Flammability Rating: UL94V-0; Insulation Resistance: 5000Mohm; Lead Spacing: 2.54mm; Material: Glass epoxy laminate body; Operating Temperature Max: 125°C; Operating Temperature Min: -65°C; Pin Format: DIP